Title:
METHOD AND APPARATUS FOR FORCEDLY COOLING SYNTHETIC RESIN MOLD DIE
Document Type and Number:
Japanese Patent JPS58188615
Kind Code:
A
Abstract:
PURPOSE: To perform uniform and efficient cooling and curing operations of moldings by cooling them partially with a forced flow device that can make cooling medium flow into projections or groove portions facing a mold cavity.
CONSTITUTION: Grooves 4, 5 are provided in the cavity 3 of the mold 1 so that the accumulated heat in the groove portions 4, 5 is hard to be dessipated when the mold is cooled but the groove portions 4, 5 can be cooled partially by the desired cooling medium in the forced flow mechanism K when the heat of the mold is to be dissipated. Dissipating effect is nearly the same as in other portions of the mold 1 and the whole mold 1 is cooled equally.
Inventors:
AMINO KATSUAKI
IKEDA HIDETOSHI
IKEDA HIDETOSHI
Application Number:
JP7124882A
Publication Date:
November 04, 1983
Filing Date:
April 30, 1982
Export Citation:
Assignee:
AOI PLASTIC KK
International Classes:
B29C67/00; B29B13/00; B29C33/00; B29C33/02; B29C33/04; B29C44/00; B29C59/00; (IPC1-7): B29C1/00; B29D27/00
Domestic Patent References:
| JP54171685B |
Attorney, Agent or Firm:
Hiroyuki Niwa