PURPOSE: To construct a semiconductor integrated circuit assembling capacitors of large capacity to the circuit by a method wherein the chip capacitors are connected to the necessary part between the terminals of a lead frame, and are insulatingly sealed with synthetic resin leaving the terminal tip parts.

CONSTITUTION: Gold plating is applied to the die attaching parts 1a at the central part and the wire bonding parts 1b of the lead frame 1. The chip 2 of the semiconductor integrated circuit is die bonded to the die attaching part 1a, and the bonding pads of the chip 2 and the terminals 1c are connected according to wire bonding 3. The chip capacitors 5 are mounted on the necessary parts between the terminals 1c to be soldered or to be connected by a conductive adhesive. The chip 2 and the chip capacitors 5 are insulatingly sealed with synthetic resin leaving the tip parts of the terminals 1c. The parts 1d provided with guide holes 1e used when the frame is put on a conveyer are cut off to produce the final product.