Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
【考案の名称】セラミック基板の放熱・給電構造
Document Type and Number:
Japanese Patent JPS5832312
Kind Code:
Y2
Inventors:
Kyoichi Iwasa
Toshinori Mori
Application Number:
JP899078U
Publication Date:
July 18, 1983
Filing Date:
January 30, 1978
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H05K1/02; H05K1/00; H05K7/20; (IPC1-7): H05K7/20; H05K1/02
Attorney, Agent or Firm:
Junnosuke Nakamura