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Title:
【発明の名称】樹脂封止形半導体装置の製造方法
Document Type and Number:
Japanese Patent JPS5845189
Kind Code:
B2
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Inventors:
MICHII KAZUNARI
SHIMODA HIROSHI
Application Number:
JP10786178A
Publication Date:
October 07, 1983
Filing Date:
September 01, 1978
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/50; H01L21/56; H01L23/48; (IPC1-7): H01L23/48; H01L21/56
Attorney, Agent or Firm:
Shinichi Kusano



 
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