Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
【発明の名称】電子線照射に曝露せしめることにより硬化し得る感圧熱熔融接着剤の製造法
Document Type and Number:
Japanese Patent JPS5846235
Kind Code:
B2
Abstract:
Hot melt pressure sensitive adhesives are prepared by free-radical copolymerizing an acrylic-based comonomer(s) with allyl acrylate or methacrylate to produce a prepolymer with an ethylenically saturated backbone containing pendant allylic unsaturation which is then applied in fluid form to a substrate and thereafter subjected to electron beam curing.

Inventors:
SUTEIBUN DEII PASUTAA
SUCHUAATO EICHI GANSURO
Application Number:
JP5443780A
Publication Date:
October 14, 1983
Filing Date:
April 25, 1980
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NASHONARU SUTAACHI ANDO CHEM CORP
International Classes:
C08F2/00; C08F2/48; C08F2/54; C08F290/00; C08F299/00; C09J4/00; C09J7/10; C09J133/04; C09J133/06; (IPC1-7): C09J3/14; C08F2/46; C08F299/00; C09J7/02
Attorney, Agent or Firm:
Ezaki Mitsuyoshi