Title:
ELECTRONIC PART SEALED BY POLYPHENYLENE SULFIDE RESIN AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPS5849749
Kind Code:
A
Abstract:
PURPOSE: To manufacture the titled electronic part having improved heat resistance of the sealing resin in soldering, by heating an electronic part sealed by polyphenylene sulfide resin in a solution of a peroxide.
CONSTITUTION: An electronic part sealed by polyphenylene sulfide resin is immersed in a mixture of a peroxide and a stabilizing diluent (e.g. acetic acid) for preferably 4W16hr, and heated at ≥200°C for ≥12hr to effect the three-dimensional crosslinking from the surface layer of the resin to the inner layer. The ratio of the peroxide to the stabilizing diluent in the mixture is preferably 75/25W25/75. The three-dimensionally crosslinked layer obtained by this process is thicker than those obtained by conventional method.
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Inventors:
EBINUMA NAOTAKE
KANEDA AIZOU
SATOU MASAAKI
YOKONO ATARU
FUKUOKA MASARU
KANEDA AIZOU
SATOU MASAAKI
YOKONO ATARU
FUKUOKA MASARU
Application Number:
JP14622281A
Publication Date:
March 24, 1983
Filing Date:
September 18, 1981
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01C1/02; C08L81/00; C08L81/02; H01B3/30; H01B3/42; H01L23/29; H01L23/31; (IPC1-7): C08L81/02; H01B3/42; H01C1/02; H01L23/30
Attorney, Agent or Firm:
Toshiyuki Usuda
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