【考案の名称】半導体ウエハホルダ装置

Title:

【考案の名称】半導体ウエハホルダ装置

Document Type and Number:

Japanese Patent JPS59187139

Kind Code:

U

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Inventors:

Hiroshi Nishida

Application Number:

JP8207783U

Publication Date:

December 12, 1984

Filing Date:

May 31, 1983

Export Citation:

International Classes:

H01L21/205; C23C14/50; H01L21/285; (IPC1-7): H01L21/285; C23C13/02; H01L21/205; H01L21/285; C23C14/50; H01L21/205

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