Title:
【考案の名称】樹脂封止半導体装置
Document Type and Number:
Japanese Patent JPS5927066
Kind Code:
Y2
Inventors:
Tomita Makoto
Application Number:
JP17964379U
Publication Date:
August 06, 1984
Filing Date:
December 24, 1979
Export Citation:
Assignee:
NEC Home Electronics Co., Ltd.
International Classes:
H01L23/32; H01L23/28; (IPC1-7): H01L23/32; H01L23/28
Attorney, Agent or Firm:
Kansai NEC Corporation