Title:
【発明の名称】化合物半導体単結晶の焼鈍方法
Document Type and Number:
Japanese Patent JPS5931855
Kind Code:
B2
Inventors:
WATANABE MASAYUKI
YASHIRO SATAO
HIRAHARA KEIJIRO
YASHIRO SATAO
HIRAHARA KEIJIRO
Application Number:
JP6017676A
Publication Date:
August 04, 1984
Filing Date:
May 26, 1976
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L21/22; H01L21/208; H01L21/324; (IPC1-7): H01L21/324; H01L21/18
Attorney, Agent or Firm:
Tomioka Akira