Title:
【考案の名称】樹脂封止半導体装置用リ-ドフレ-ム
Document Type and Number:
Japanese Patent JPS60118252
Kind Code:
U
Inventors:
Yuu Okuaki
Application Number:
JP425984U
Publication Date:
August 09, 1985
Filing Date:
January 18, 1984
Export Citation:
International Classes:
H01L23/50; H01L23/28; H01L23/48; (IPC1-7): H01L23/48; H01L23/28