Title:
【発明の名称】熱圧縮ギヤングボンデイング用銅部材の酸化防止被覆形成装置
Document Type and Number:
Japanese Patent JPS6025898
Kind Code:
B2
Abstract:
Copper parts associated with thermal compression bonding of lead structures to a semiconductive device, such as the lead frame, the interconnect lead, and the gang bonding bumps, are coated with an antioxidant material. The antioxidant material and its thickness are chosen to be compatible with thermal compression bonding therethrough so that the completed thermal compression bond forms a bonding interface to the copper through the antioxidant coating. Suitable antioxidant coating materials include, gold, chromate, and copper phosphate.
Inventors:
KAAMEN DEII BAANZU
Application Number:
JP6444376A
Publication Date:
June 20, 1985
Filing Date:
June 02, 1976
Export Citation:
Assignee:
NAT SEMICONDUCTOR CORP
International Classes:
B23K20/00; H01L21/52; H01L21/60; H01L21/603; H01L23/485; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Kyozo Yuasa
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