Title:
【考案の名称】集積回路素子の実装構造
Document Type and Number:
Japanese Patent JPS6066029
Kind Code:
U
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Inventors:
Kurisaka Masaru
Application Number:
JP15742283U
Publication Date:
May 10, 1985
Filing Date:
October 12, 1983
Export Citation:
International Classes:
H01L23/52; H01L21/60; H01L23/48; (IPC1-7): H01L21/60; H01L23/48; H01L23/52