Title:
【考案の名称】半導体素子用放熱板
Document Type and Number:
Japanese Patent JPS6092843
Kind Code:
U
Inventors:
Nakano Isao
Mitsuru Taneda
Mitsuru Taneda
Application Number:
JP18514983U
Publication Date:
June 25, 1985
Filing Date:
November 30, 1983
Export Citation:
International Classes:
H01L23/36; (IPC1-7): H01L23/36
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