Document Type and Number:
Japanese Patent JPS6259889
Kind Code:
B2
More Like This:
WO/2018/135327 | LIQUID IMMERSION COOLING DEVICE, LIQUID IMMERSION COOLING SYSTEM, AND ELECTRONIC DEVICE COOLING METHOD |
JPS57162453 | HEAT RADIATING DEVICE |
JPH02161760 | SEMICONDUCTOR STACK |
Inventors:
NAKAO KAZUNARI
FUJII MASAO
TETSUNO HARUO
FUJII MASAO
TETSUNO HARUO
Application Number:
JP20864881A
Publication Date:
December 14, 1987
Filing Date:
December 22, 1981
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/44; F25B23/00; F28F13/06; H01L23/427