Japanese Patent JPS6329829

B2

PURPOSE:To improve the cooling characteristic of the subject device by a method wherein a rectifying plate, which forms the passage of liquid refrigerant, is provided between the internal wall surface of a container and the heating element assembled unit and the flow of the liquid refrigerant induced by ascending air bubbles is positively utilized. CONSTITUTION:When the rectifying plate 7, which was provided in such a manner that the circulating flow of the liquid refrigerant 2 will be flowing along the internal wall surface of the container 3, and a duct 6 are formed in the boiling and cooling device, the liquid refrigerant 2 flows into the duct 6 from the lower part by the help of the driving force generated in the duct 6 located in the heating element assembled unit 1, and flows out from the upper part of the duct 6. The ran out liquid refrigerant 2 circulates the passage 8 that was formed between the inner wall surface of the container 3 and the rectifying plate 7, and then it flows into the lower part of the duct 6. Accordingly, the flow of the liquid refrigerant 2 induced in the duct 6 passes through the passage 8 in good order, and the convectional heat transferring characteristic between the liquid refrigerant 2 in the passage 8 and the inner wall surface can be improved.

JPS5658250	COOLER
JPH0278256	DIPPING/COOLING MODULE

FUJII MASAO
TETSUNO HARUO
NAKAO KAZUNARI

JP5346681A

June 15, 1988

April 07, 1981

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MITSUBISHI ELECTRIC CORP

H01L23/44; F25B23/00; F25D9/00; F28D15/02; F28F13/06; H01L23/427

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