Title:
半導体装置
Document Type and Number:
Japanese Patent JPWO2013108706
Kind Code:
A
Inventors:
Junji Tono
Application Number:
JP2013050288W
Publication Date:
May 11, 2015
Filing Date:
January 10, 2013
Export Citation:
Assignee:
Mitsubishi Electric Corp.
International Classes:
H01L25/07; H01L25/18; H01L21/52
Attorney, Agent or Firm:
大岩 増雄
竹中 岑生
村上 啓吾
吉澤 憲治
竹中 岑生
村上 啓吾
吉澤 憲治