Document Type and Number:
Japanese Patent JPWO2020203438
Kind Code:
A1
Abstract:
This protection sheet for semiconductor processing has, in order, a base material, and upon the base material, an intermediate layer and an adhesive layer. The product of the tensile storage modulus of the base material and the thickness of the base material is 8.0×105 N/m or less, and the residual stress in the intermediate layer after the intermediate layer is kept at 65°C for 300 seconds is 10000 Pa or less.
Application Number:
JP2021511490A
Publication Date:
October 08, 2020
Filing Date:
March 24, 2020
Export Citation:
