Document Type and Number:
Japanese Patent JPWO2021192933
Kind Code:
A1
Abstract:
The present invention provides a multilayer body for thin film layer transfer, said multilayer body enabling the formation of a transferred object that is suppressed in the occurrence of defects such as pin holes or transfer failure. A multilayer body which satisfies formulae (1), (2) and (3), wherein a mold release base material film, a thin film layer and a masking film are sequentially stacked in this order. (1): 0.01 ≤ Y/X ≤ 0.7 (wherein X represents the peel strength between the mold release base material film and the thin film layer, and Y represents the peel strength between the thin film layer and the masking film) (2): Sku ≤ 40 (wherein Sku represents the kurtosis of the mold release surface of the mold release base material film) (3): Sq ≤ 20 nm (wherein Sq represents the root mean square roughness of the mold release surface of the mold release base material film)
Application Number:
JP2021529408A
Publication Date:
September 30, 2021
Filing Date:
March 05, 2021
Export Citation:
