Document Type and Number:
Japanese Patent JPWO2022070503
Kind Code:
A1
Abstract:
A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2):(1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 µm or less; and(2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25°C of 0.1 g or less;a film-shaped transparent adhesive processed therefrom;a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive;a method of producing an electronic component; andan electronic component.
Application Number:
JP2021559598A
Publication Date:
April 07, 2022
Filing Date:
May 26, 2021
Export Citation:
