Document Type and Number:
Japanese Patent JPWO2022158258
Kind Code:
A1
Abstract:
This semiconductor device comprises: a substrate; a circuit pattern including a first circuit board, a second circuit board, a third circuit board and a fourth circuit board which are positioned apart from one another; a plate-shaped first electrode connected to the first circuit board; a plate-shaped second electrode connected to the second circuit board and the third circuit board; a plate-shaped third electrode connected to the fourth circuit board; a first semiconductor chip; a second semiconductor chip; a first electroconductive member; and a second electroconductive member. The second electrode includes a first portion, which is arranged parallel to the third electrode with a gap therebetween, and/or a second portion, which is arranged parallel to the first electrode with a gap therebetween.
Application Number:
JP2022577070A
Publication Date:
July 28, 2022
Filing Date:
December 24, 2021
Export Citation:
