Document Type and Number:
Japanese Patent JPWO2022172351
Kind Code:
A1
Abstract:
A semiconductor power module according to the present disclosure is provided with a semiconductor element, a substrate on which the semiconductor element is mounted, a base plate on which the substrate is mounted, a case housing the base plate and the semiconductor element, and a sealing material that is filled in a region defined by the base plate and the case and covers at least the semiconductor element, wherein the sealing material is a silicone gel including a silicone resin as the main component and an ionic substance forming a covalent bond with a silicone skeleton of the silicone resin.
Application Number:
JP2022581070A
Publication Date:
August 18, 2022
Filing Date:
February 10, 2021
Export Citation:
Domestic Patent References:
| JP2006002076A | 2006-01-05 | |||
| JP2005032879A | 2005-02-03 |
Foreign References:
| WO2014097798A1 | 2014-06-26 |