Document Type and Number:
Japanese Patent JPWO2023013441
Kind Code:
A1
Abstract:
One embodiment of the present invention relates to a composition or a filler mixture. The composition includes a thermally conductive filler (A) having a particle size (D50 (A)) at 50% cumulative volume of 0.05 μm to less than 1.0 μm and a particle size (D90 (A)) at 90% cumulative volume of 2.0 μm or less in a particle size distribution curve by a laser diffraction method, a thermally conductive filler (B), and a binder component (C), and satisfies the following requirements (1)-(3). Requirement (1): the cumulative pore volume of pores having a diameter of 0.5 μm or less calculated from the pore diameter distribution measured by a mercury porosimeter of the entire thermally conductive filler (B) used in the composition is 0.05 mL/g or less. Requirement (2): the particle size (D50 (B)) at 50% cumulative volume of the entire thermally conductive filler (B) used in the composition is 1.0-100 μm. Requirement (3): the particle size (D10 (B)) at 10% cumulative volume of the entire thermally conductive filler (B) used in the composition is 0.6 μm or more.
Application Number:
JP2023540255A
Publication Date:
February 09, 2023
Filing Date:
July 22, 2022
Export Citation:
