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Patent Searching and Data


Title:
RESIN COMPOSITION AND PROCESS FOR PRODUCING MOLDING
Document Type and Number:
WIPO Patent Application WO/2003/044093
Kind Code:
A1
Abstract:
A resin composition which can have improved moldability because it attains, e.g., reductions in extrusion pressure and extrusion torque in engineering plastic molding, can stably have the moldability with respect to extrusion pressure, extrusion torque, etc., and can be easily crystallized. The resin composition is obtained by compounding an engineering plastic with a fluoropolymer, wherein the amount of the fluoropolymer is 0.005 to 1 wt.% based on the sum of the engineering plastic and the fluoropolymer and the fluoropolymer is a perfluoropolymer. The resin composition is characterized by being used in extrusion molding or injection molding.

Inventors:
KUBO KATSUYOSHI (US)
OTSUKA TAKAHIDE (US)
OKA MASAHIKO (US)
MIYAMORI TSUYOSHI (JP)
STEWART CHARLES DI
Application Number:
PCT/JP2002/012148
Publication Date:
May 30, 2003
Filing Date:
November 21, 2002
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
KUBO KATSUYOSHI (US)
OTSUKA TAKAHIDE (US)
OKA MASAHIKO (US)
STEWART CAROLYN HF (US)
MIYAMORI TSUYOSHI (JP)
International Classes:
C08G65/00; C08L59/02; C08L71/00; C08L101/00; (IPC1-7): C08L101/00
Foreign References:
US5998339A1999-12-07
JPH0391556A1991-04-17
JPH06136255A1994-05-17
Attorney, Agent or Firm:
Yasutomi, Yasuo (Nishinakajima 5-chome Yodogawa-ku Osaka-shi, Osaka, JP)
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