Title:
COPPER SURFACE PROCESSING AGENT, SURFACE PROCESSING METHOD, AND COPPER SURFACE FILM
Document Type and Number:
WIPO Patent Application WO/2010/007755
Kind Code:
A1
Abstract:
Disclosed is a copper surface film that can be processed to a smooth surface without increasing the number of processing steps and without a roughening process such as etching of the copper surface, and in which the adhesion between the copper and an insulating material such as resin or the like can be maintained. Said film contains an alloy of copper and tin, the weight of the tin in the copper surface film is between 1 mg/m2 and 2,000 mg/m2, and within the composition in the outermost surface of the aforementioned film, the molar ratio of copper to tin is between 0.2 and 2.0.
Inventors:
INBE TOSHIO
UTSUNOMIYA AKIRA
NISHIDA SHINYA
UTSUNOMIYA AKIRA
NISHIDA SHINYA
Application Number:
PCT/JP2009/003275
Publication Date:
January 21, 2010
Filing Date:
July 13, 2009
Export Citation:
Assignee:
NIPPON PAINT CO LTD (JP)
INBE TOSHIO
UTSUNOMIYA AKIRA
NISHIDA SHINYA
INBE TOSHIO
UTSUNOMIYA AKIRA
NISHIDA SHINYA
International Classes:
C23C18/48
Foreign References:
| JP2008109111A | 2008-05-08 | |||
| JP2006225691A | 2006-08-31 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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