Title:
PROCESS FOR FORMATION OF HIERARCHICAL MICROSTRUCTURE USING PARTIAL CURING
Document Type and Number:
WIPO Patent Application WO/2010/123162
Kind Code:
A1
Abstract:
Disclosed is a simplified process for formation of a hierarchical microstructure having no heterogeneous interface using partial curing. To achieve the above, provided is a process for the formation of a hierarchical microstructure using partial curing which comprises the steps of: forming a first polymer pattern having a partial curing layer; and forming a second polymer pattern on the first polymer pattern using said partial curing layer. According to the present invention, the formation of a microstructure having various hierarchical structures can be simplified. Therefore, the productivity and economic efficiency of various processes which require the formation of a microstructure having various hierarchical structures can be enhanced. In addition, a new functional material can be developed, which has not only a super hydrophobic surface but also high adhesiveness even on rough surfaces.
Inventors:
SUH KAHP YANG (KR)
JEONG HOON EUI (KR)
KAWK NO KYUN (KR)
JEONG HOON EUI (KR)
KAWK NO KYUN (KR)
Application Number:
PCT/KR2009/002052
Publication Date:
October 28, 2010
Filing Date:
April 20, 2009
Export Citation:
Assignee:
SNU R&DB FOUNDATION (KR)
SUH KAHP YANG (KR)
JEONG HOON EUI (KR)
KAWK NO KYUN (KR)
SUH KAHP YANG (KR)
JEONG HOON EUI (KR)
KAWK NO KYUN (KR)
International Classes:
H01L21/027; B82B3/00
Foreign References:
| US6355198B1 | 2002-03-12 | |||
| KR100850435B1 | 2008-08-05 | |||
| KR20080103541A | 2008-11-27 |
Attorney, Agent or Firm:
LEE, JONG HYUK (KR)
이종혁 (KR)
이종혁 (KR)
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