Title:
２成分無溶剤接着剤組成物
Document Type and Number:
Japanese Patent JP7171922
Kind Code:
B2
Abstract:
The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component containing the reaction product of (i) an isocyanate monomer and (ii) a first dimer acid polyester polyol; and (B) a polyol component containing (i) a second dimer acid polyester polyol and (ii) optionally, a polyol selected from a polyether polyol, a polyester polyol, and combinations thereof. The two-component solvent-less adhesive composition contains from 15 wt % to 45 wt % units derived from dimer acid, based on the total weight of the two-component solvent-less adhesive composition.
Inventors:
Shi, Louis
Chu, Tsao Hoi
Kuo, Incheon
Chu, Tsao Hoi
Kuo, Incheon
Application Number:
JP2021535236A
Publication Date:
November 15, 2022
Filing Date:
December 21, 2018
Export Citation:
Assignee:
Dow Global Technologies LLC
International Classes:
C09J175/06; C08G18/12; C08G18/68
Domestic Patent References:
| JP201095672A | ||||
| JP2001335771A |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Norio Omori
Eiji Katayama
Norio Omori
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