To suppress the deformation of a stamper of a 2P molding device and the occurrence of foreign matter.

This device transfers the patterns of a stamper surface to a transparent substrate by bringing a transparent substrate and the stamper into tight contact with each other across a photosetting resin, solidifying the resin by irradiating with light, then separating the transparent substrate and the stamper. The device has a central shaft 8 which is movable in the central hole of the stamper 2 in a perpendicular direction and holds the transparent substrate 5, a stamper holder 1 for holding the stamper 2, a translucent flat plate 6 arranged to face the stamper, a stamper holder moving means 10 for bringing the transparent substrate 5 and the stamper 2 into pressurized and tight contact with each other, a UV lamp 7 for irradiating the photosetting resin with light and a moving means 3 for the central shaft 8. The stamper holder 1 has a stamper base 11 in contact with the rear surface of the stamper and the stamper base has a spot facing 16 or through-hole larger than the bore of the stamper in its central part.