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Patent Searching and Data


Title:
研磨具ホルダおよび研磨工具
Document Type and Number:
Japanese Patent JP7142848
Kind Code:
B2
Abstract:
A polishing device (1) includes a polishing brush (3) and a polishing brush holder (4) that holds the polishing brush (3). The polishing brush holder (4) includes a shank (6), a support mechanism (21) that has a sleeve (7) and supports the polishing brush (3) so as to be movable in an axial direction L of the shank (6), and a moving mechanism (22) that moves the polishing brush (3) in the axial direction L. The polishing brush holder (4) includes a pressure sensor (53) that detects a load (sensor detection pressure (P)) applied from a workpiece (W) to the polishing brush (3) when the workpiece (W) is polished by the polishing brush (3) supported by the support mechanism (21), and a control unit (51) that drives the moving mechanism (22) on the basis of the output (sensor detection pressure (P)) from the pressure sensor (53) to move the polishing brush (3) in the axial direction L.

Inventors:
Keisuke Fukushima
Youichi Sato
Application Number:
JP2019564279A
Publication Date:
September 28, 2022
Filing Date:
June 14, 2018
Export Citation:
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Assignee:
Xebec Technology Co., Ltd.
Daimei Chemical Industry Co., Ltd.
International Classes:
B24B49/16; B24B29/00; B24B45/00; B24D3/28; B24D13/14
Domestic Patent References:
JP2003031530A
JP2007168051A
Foreign References:
WO2016021460A1
US20140235142
US8250720
Attorney, Agent or Firm:
Kawai Toru
Nobuko Kawaguchi