Title:
砥粒帯鋸刃
Document Type and Number:
Japanese Patent JP7149358
Kind Code:
B2
Abstract:
To make it possible to suppress bending of a cut surface of a work-piece and perform stable cutting even under high-load cutting conditions such that a cutting length of the work-piece is longer, or a feed speed of an abrasive band saw blade is higher.SOLUTION: An abrasive grain layer 14 is electrically deposited on one side edge part of a base metal 12 along a circumferential direction, a plurality of first projections 16 and a plurality of second projections 18, which respectively project to both sides in a band thickness direction, are formed on the abrasive grain layer 14 at intervals in the circumferential direction, a plurality of division parts 20, which divide the abrasive grain layer 14 into a plurality of areas A, are formed on one side edge part of the base metal 12 at intervals in the circumferential direction, and the ratio P2/(P1+P2) of the division parts 20 is set to 0.2 to 17%.SELECTED DRAWING: Figure 1
Inventors:
Yuji Nagano
Masayuki Okada
Shinji Tsujimoto
Masayuki Okada
Shinji Tsujimoto
Application Number:
JP2021021017A
Publication Date:
October 06, 2022
Filing Date:
February 12, 2021
Export Citation:
Assignee:
Amada Co., Ltd.
Amada Machinery Co., Ltd.
Amada Machinery Co., Ltd.
International Classes:
B23D61/12; B28D1/08
Domestic Patent References:
| JP2005145726A | ||||
| JP2008044018A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
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