Title:
研磨剤組成物とそれによる研磨方法
Document Type and Number:
Japanese Patent JP4860152
Kind Code:
B2
Abstract:
To provide a polishing slurry composition which effectively reduces the occurrence of scratches, and a method of polishing which reduces the occurrence of scratches while realizing an economical polishing step. The aforementioned object is attained by using a polishing slurry composition for polishing a semiconductor substrate containing a metal oxide particle, at least one water-soluble organic polymer and water, said slurry composition characterized in that, when a test substrate having a metal film, a shallow trench isolation film or dielectric film is polished by varying a rate of a polishing pad equipped in a polishing apparatus under a constant polishing pressure to achieve a maximum polishing rate.
Inventors:
Haruki Nojo
Akiyoshi Yoshida
Kashiwabara Hiroshi
Belal, Pascal
Akiyoshi Yoshida
Kashiwabara Hiroshi
Belal, Pascal
Application Number:
JP2004552235A
Publication Date:
January 25, 2012
Filing Date:
November 13, 2003
Export Citation:
Assignee:
DuPont Air Products Nanomaterials LLC
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14; H01L21/306; H01L21/3105
Domestic Patent References:
| JPH08316179A | 1996-11-29 | |||
| JPH07254579A | 1995-10-03 | |||
| JPH0786215A | 1995-03-31 |
Foreign References:
| WO2002083804A1 | 2002-10-24 |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Junko Kobayashi
Kaoru Kuroda
Norio Omori
Eiji Katayama
Junko Kobayashi
Kaoru Kuroda
Norio Omori