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Title:
ABRASIVE GRAIN FALLING-SUPPRESSING GRINDSTONE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH01127270
Kind Code:
A
Abstract:
PURPOSE:To enhance an effective utilization factor of an abrasive grain suppressed from its falling by connecting a rough surface, formed in a surface of a whisker compound synthetic resin film coating the abrasive grain, to a bond composite and giving break resistance to this film by the whisker composition. CONSTITUTION:Coating a diamond abrasive gain or a cubic system boron nitride abrasive grain with a film of synthetic resin compounding whisker forming a rough surface in a film surface coating the abrasive grain while giving break resistance to this film, a mixture, adding a synthetic resin bond agent dust to the diamond abrasive grain or the cubic system boron nitride abrasive grain, is used for a grindstone forming material. Pressurizing this material to be molded, the molded product is baked by heating, obtaining a desired grindstone. Here exposing one part of the whisker, compounded in the synthetic resin of the film coating the abrasive grain, in the surface of the film, many quantity in this exposed part, forming a rough surface in the surface of this film, strongly connect to a synthetic resin bond composite. Simultaneously the whisker, compounded in this film, generates whisker composition, giving break resistance to this film, and stiffly connecting the abrasive grain with no break of this film, the abrasive grain is suppressed from its falling.

Inventors:
KURATOMI TATSURO
Application Number:
JP28209087A
Publication Date:
May 19, 1989
Filing Date:
November 10, 1987
Export Citation:
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Assignee:
KURATOMI TATSURO
International Classes:
B24D3/02; B24D3/00; B24D3/28; (IPC1-7): B24D3/00; B24D3/02; B24D3/28
Domestic Patent References:
JPS4910968A1974-01-30
JPS5040275A1975-04-12
JPS50101989A1975-08-12