Title:
ラッピング加工用研磨材およびそれを用いた基板の製造方法
Document Type and Number:
Japanese Patent JP5819515
Kind Code:
B2
Inventors:
Yokoyama Hideki
Youya Oya
Jun Ito
Nobumi Mayumi
Chihiro Hayakawa
Youya Oya
Jun Ito
Nobumi Mayumi
Chihiro Hayakawa
Application Number:
JP2014506237A
Publication Date:
November 24, 2015
Filing Date:
March 19, 2013
Export Citation:
Assignee:
Fujimi Incorporated Co., Ltd.
International Classes:
C09K3/14; B24B37/00; B24B57/02; H01L21/304
Domestic Patent References:
| JP2004149582A | ||||
| JP8113773A | ||||
| JP1121164A | ||||
| JP4146987A |
Attorney, Agent or Firm:
Hirohito Katsunuma
Hideaki Maekawa
Hideaki Maekawa
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