Title:
研磨液組成物
Document Type and Number:
Japanese Patent JP6959857
Kind Code:
B2
Abstract:
To provide a polishing liquid composition capable of reducing short wavelength wave on a substrate surface after polishing without largely deteriorating polishing rate in polishing using a silica particle as an abrasive grain.SOLUTION: There is related a polishing liquid composition containing a silica particle A, an inorganic particle B and water, in which surface potential in a solution of the inorganic particle B at pH 1.4 is over 0 mV and 75 mV or less, content of the inorganic particle B is 0.01 pts.mass ot 1 pts.mass based on 100 pts.mass of the silica particle A and pH is less than 9.SELECTED DRAWING: None
Inventors:
Shunsuke Sakamoto
Application Number:
JP2017254080A
Publication Date:
November 05, 2021
Filing Date:
December 28, 2017
Export Citation:
Assignee:
Kao Corporation
International Classes:
C09K3/14; B24B37/00; C09G1/02; G11B5/84; H01L21/304
Domestic Patent References:
| JP2017179220A | ||||
| JP2014130659A | ||||
| JP2004311575A | ||||
| JP2006096977A |
Foreign References:
| WO2015146942A1 | ||||
| WO2017038201A1 | ||||
| WO2005109481A1 | ||||
| CN104178033A |
Attorney, Agent or Firm:
Patent business corporation Ikeuchi and Partners