Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ABRASIVE PAD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2002018731
Kind Code:
A
Abstract:

To provide a CMP abrasive pad having a hydrophilic property and improved in the retainability of abrasive slurry.

Abrasive inorganic fine-grains are dispersed at 10-90 wt.% in regenerated cellulose.


Inventors:
MURAMOTO TEI
HIGASHIYAMA SATORU
SAITO HIDENAO
TOMINAGA SHIGERU
TAIRA TETSUJI
Application Number:
JP2000203577A
Publication Date:
January 22, 2002
Filing Date:
July 05, 2000
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
RENGO CO LTD
ROKI TECHNO CO LTD
ACE KK
International Classes:
B24B37/20; B24B37/24; B24D3/00; B24D11/00; H01L21/304; (IPC1-7): B24D11/00; B24B37/00; B24D3/00; H01L21/304
Attorney, Agent or Firm:
Bunji Kamata (2 outside)



 
Previous Patent: DIAMOND WHEEL

Next Patent: LAPPING PAPER