Title:
ABRASIVE PAD
Document Type and Number:
Japanese Patent JP2008168431
Kind Code:
A
Abstract:
To provide an abrasive pad used for the chemical mechanical polishing which sufficiently suppresses occurrence of scratches on a surface to be polished.
A circular recess is formed on a non-abrasive surface side of an abrasive pad to suppress generation of excessive stresses in a center of the abrasive pad. The recess is located in a center of a surface to be polished, and its depth is 0.01-2 mm. The abrasive pad is formed of a material consisting of a water insoluble matrix and water-soluble particles dispersed in the matrix. The depth of grooves is made larger than the size of the water-soluble particles.
Inventors:
HOSAKA YUKIO
SHIHO KOUJI
HASEGAWA TORU
KAWAHASHI NOBUO
SHIHO KOUJI
HASEGAWA TORU
KAWAHASHI NOBUO
Application Number:
JP2008043967A
Publication Date:
July 24, 2008
Filing Date:
February 26, 2008
Export Citation:
Assignee:
JSR CORP
International Classes:
B24B37/24; B24B37/26; H01L21/304
Domestic Patent References:
| JP2002141313A | 2002-05-17 | |||
| JPH1177515A | 1999-03-23 | |||
| JPH08309658A | 1996-11-26 | |||
| JPH11151662A | 1999-06-08 | |||
| JP2000094303A | 2000-04-04 | |||
| JP2001334455A | 2001-12-04 | |||
| JP2003100682A | 2003-04-04 |
Attorney, Agent or Firm:
Mitsue Obuchi
Yukio Fuse
Mina Tsuzuki
Yukio Fuse
Mina Tsuzuki
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