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Title:
ABRASIVE PARTICLE TOOL WITH PRECISELY CONTROLLED ARRANGEMENT OF ABRASIVE PARTICLE AND METHOD FOR FABRICATION
Document Type and Number:
Japanese Patent JP2010076091
Kind Code:
A
Abstract:

To provide an abrasive tool capable of precisely controlling the arrangement or the pattern of abrasive particles.

A method for fabricating an abrasive tool having a work surface commences by a step of providing an electrically non-conductive layer 36 on the work surface of the abrasive tool 34. A pattern is etched in the work surface preferably using a laser beam. Metal and abrasive particles 40, 42, 44 are electroplated or electrolessly-plated onto the work surface pattern. The non-conductive layer is removed from the work surface. Alternatively, an adhesive can be applied as a layer on the work surface. A negative pattern then is etched in the adhesive layer, i.e., the adhesive where no abrasive is desired is etched away. Abrasive particles are then brought into contact with the work surface to be adhered thereon to the remaining adhesive. Metal again can be electroplated or electrolessly-plated onto the work surface. Through the multiple repetitions of both methods, different sizes and types of abrasive particles in different concentrations may be applied to different areas of the work surface.


Inventors:
VON DUNGEN JURGEN
FALKENBERG YORK
HEINEMANN DIRK
Application Number:
JP2009225663A
Publication Date:
April 08, 2010
Filing Date:
September 30, 2009
Export Citation:
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Assignee:
DIAMOND INNOVATIONS INC
International Classes:
B24D3/00; B24D3/06; B24D18/00
Domestic Patent References:
JPS6430161U1989-02-23
JPS6076965A1985-05-01
Attorney, Agent or Firm:
Taro Yaguchi