Title:
吸収式ヒートポンプ装置
Document Type and Number:
Japanese Patent JP6686484
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an absorptive heat pump device capable of preventing a dimension in a height direction of a whole evaporator from being enlarged while maintaining performance of a heat exchanger.SOLUTION: An absorptive heat pump device includes an evaporator 30 configured to evaporate refrigerant, and an absorber configured to absorb refrigerant steam evaporated at the evaporator 30 to absorbent (LiBr aqueous solution). The evaporator 30 includes: a heat exchange unit configured to utilize evaporative latent heat of refrigerant to perform heat exchange; and a refrigerant storage unit 31c provided in an end part region 31g deviated toward an arrow X1 direction from a region (storage portion 31b) in which the heat exchange unit is arranged, in a plan view, and configured to store refrigerant (water) supplied to the heat exchange unit.SELECTED DRAWING: Figure 2
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Inventors:
Yusuke Ebata
Osamu Tsubouchi
Akira Tomita
Osamu Tsubouchi
Akira Tomita
Application Number:
JP2016017893A
Publication Date:
April 22, 2020
Filing Date:
February 02, 2016
Export Citation:
Assignee:
Aisin Seiki Co., Ltd.
International Classes:
F25B15/00; F25B37/00; F25B39/02; F25B39/04
Domestic Patent References:
| JP5018627A | ||||
| JP54105960U | ||||
| JP2015114093A |
Foreign References:
| US20020100292 |
Attorney, Agent or Firm:
Hirokazu Miyazono