To provide an accommodation body which can prevent the generation of foreign matters and damage to an accommodated article, and can reduce a risk that an adhesive material may be transferred and stuck to the accommodated article, and to provide a manufacturing method of a carrier tape and its manufacturing device.
The accommodation body comprises: a tape body 1; a plurality of pocket holes 20 which are formed in parallel with the tape body 1, and accommodate semiconductor chips 10; and a cover tape 30 which is adhered to the tape body 1 so as to be peeled off therefrom, and covers the plurality of pockets 20. An adhesive layer 40 for weakly adhering the semiconductor chips 10 so as to be freely attachable and detachable is adhered on the bottom face of each pocket hole 20, the adhesive layer 40 has a size which prevents the adhesive layer from outwardly protruding from the semiconductor ship 10 at the weak adhesion of the semiconductor chip 10, and the total value of the thickness of the adhesive layer 40 and the thickness of the semiconductor chip 10 is made to be not larger than the depth of the pocket hole 20. Since the semiconductor chips 10 are accommodated in the pocket holes 20 via the adhesive layer 40, the semiconductor chips 10 vertically and laterally move around by vibration and impacts, and thus the semiconductor chips can be prevented from colliding with surrounding walls of the pocket holes 20 and the cover tape 30.
HOSONO NORIYOSHI
TANIGUCHI ATSUSHI
| JPH06127583A | 1994-05-10 | |||
| JP2000103496A | 2000-04-11 |
Masayoshi Kanda
Akio Miyao
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