Title:
音響チップ
Document Type and Number:
Japanese Patent JP5685621
Kind Code:
B2
Abstract:
A thermoacoustic chip includes a substrate, a sound wave generator, a first electrode, and a second electrode, and an integrated circuit chip. The substrate has a first surface. The sound wave generator is located on the first surface of the substrate. The first electrode and a second electrode are spaced from each other and electrically connected to the sound wave generator. The integrated circuit chip is located on the substrate and electrically connected to the first electrode and the second electrode.
Inventors:
魏 洋
▲ハン▼ 守善
▲ハン▼ 守善
Application Number:
JP2013128388A
Publication Date:
March 18, 2015
Filing Date:
June 19, 2013
Export Citation:
Assignee:
ツィンファ ユニバーシティ
鴻海精密工業股▲ふん▼有限公司
鴻海精密工業股▲ふん▼有限公司
International Classes:
H04R23/00
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Jitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Jitsuhiro