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Title:
ACOUSTIC SENSOR, AND SOUND MODULE WITH ACOUSTIC SENSOR
Document Type and Number:
Japanese Patent JP2008085507
Kind Code:
A
Abstract:

To provide an acoustic sensor which can relax the residual stress of a diaphragm or a stress acting on the diaphragm from a supporting portion although the diaphragm and a fixed plate can be used while being isolated from external atmosphere as required, and to provide a sound module with that acoustic sensor.

In the acoustic sensor, a diaphragm 4 closing the opening of a supporting portion 3 has a portion 11 which vibrates by receiving a sound wave, and a stress relaxing portion 12 coupling the vibrating portion 11 and the supporting portion 3 such that the vibrating portion 11 opposes a fixed plate 5 through a gap g of first length G1 under a state where a bias voltage is not applied between a fixed electrode 7 and a movable electrode 8. The vibrating portion 11 is attracted to the fixed plate 5 side when a bias voltage is applied and abuts against a spacer 9 to ensure a gap g of second length G2 to the fixed plate 5. The stress relaxing portion 12 employs a corrugate structure of waving cross-section in order to block transmission of stress between the supporting portion 3 and the vibrating portion 11.


Inventors:
USHIYAMA NAOKI
KAWADA HIROSHI
YOSHIDA TAKESHI
TAKAHATA TOSHIHIKO
ARIKAWA YASUSHI
MARUYAMA HIROSHI
Application Number:
JP2006261492A
Publication Date:
April 10, 2008
Filing Date:
September 26, 2006
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H04R19/04
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori