Title:
弾性波デバイスおよびその製造方法、フィルタ及びマルチプレクサ
Document Type and Number:
Japanese Patent JP7426196
Kind Code:
B2
Abstract:
To improve a heat dissipation.SOLUTION: An acoustic wave device comprises: a first substrate having a support substrate and a piezoelectric substrate directly or indirectly bonded onto the support substrate; a plurality of metal layers which is filled in each of a plurality of opens penetrating the piezoelectric substrate, and contains a first metal layer and a second metal layer; an elastic wave element that is provided on the piezoelectric substrate and electrically connected to at least one of the plurality of metal layers; one or a plurality of via wirings that penetrates the support substrate, and contains a first via wiring connected to the first metal layer; a second substrate which is opposite to a face in which the acoustic wave element of the piezoelectric substrate is provided via a gap, and is mounted on the first substrate; and a plurality of bumps that contains a first bump and a second bump which connect the first metal layer and the second metal layer with the second substrate, respectively, and in which the first bump is overlapped with the first via wiring in a plan view, and the second bump is not overlapped with one or the plurality of via wirings in the plan view.SELECTED DRAWING: Figure 1
Inventors:
Satoshi Ichinose
黒▲柳▼ ▲琢▼真
Kazushige Hatayama
黒▲柳▼ ▲琢▼真
Kazushige Hatayama
Application Number:
JP2019048977A
Publication Date:
February 01, 2024
Filing Date:
March 15, 2019
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H03H9/25; H03H3/02; H03H3/08; H03H9/17; H03H9/54; H03H9/64
Domestic Patent References:
| JP2018207144A | ||||
| JP2001332654A | ||||
| JP2017188807A | ||||
| JP2017204544A | ||||
| JP2011066492A | ||||
| JP2017169139A | ||||
| JP2017204827A | ||||
| JP2018207045A |
Attorney, Agent or Firm:
Shuhei Katayama