Title:
ACRYLIC RESIN COMPOSITION AND PANEL MATERIAL FOR BUILDING
Document Type and Number:
Japanese Patent JP2023061791
Kind Code:
A
Abstract:
To form a cured product that does not suffer a significant decrease in elastic modulus even at high temperatures, from an acrylic resin composition that is low in viscosity compared to epoxy resin and the like and can also be cured at low temperatures.SOLUTION: An acrylic resin composition comprises a polymerizable compound comprising at least one monomer mi (1≤i≤N) and a curing agent and gives a cured product with the ratio of a storage modulus at 250°C to that at 25°C being 20% or more.SELECTED DRAWING: Figure 1
Inventors:
NISHIDA HIROFUMI
Application Number:
JP2021171931A
Publication Date:
May 02, 2023
Filing Date:
October 20, 2021
Export Citation:
Assignee:
KANAZAWA INST OF TECHNOLOGY
International Classes:
C08F20/20; E04B1/94; E04C2/20; E04C2/36
Attorney, Agent or Firm:
Patent Attorney Kawasaki Patent Office
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