Title:
ACRYLIC RESIN COMPOSITION TO BE USED AS MOLDING MATERIAL FOR SMC AND BMC, MOLDING MATERIAL, AND MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP3817745
Kind Code:
B2
Abstract:
PURPOSE: To obtain an acrylic resin composition to be used as a molding material for SMC and BMC, which is improved in operability and productivity, doesn't need extra aging, and can be thickened quickly even at room temperature to attain the viscosity at which molding is possible by introducing a long- chain (meth)acrylic acid containing one or more carboxyl groups into the end of an acrylic resin composition.
CONSTITUTION: This acrylic resin composition to be used as a molding material for SMC and BMC comprises a (meth)acrylate copolymer (A) and a polymerizable unsaturated monomer (B). The copolymer (A) has a number- average molecular weight of 3,000 to 100,000 and contains as the essential ingredients a (meth)acrylate monomer (A1) and a long-chain (meth)acrylate (A2) having one or more carboxyl groups at the end thereof. Examples of the (meth)acrylate (A2) include those having a number-average molecular weight of 150 to 2,000 and obtained by the ring-opening polymerization of ε-caprolactum with (meth)acrylic acid. The ratios of (A1) to (A2) and (A) to (B) are 80-99.5/0.5-20 and 20-80/20-80, respectively, by weight. Molded products are obtained by press molding this composition at 40 to 180°C.
Inventors:
Kanagawa Yoshinori
Sachiko Fujita
Sachiko Fujita
Application Number:
JP13712394A
Publication Date:
September 06, 2006
Filing Date:
June 20, 1994
Export Citation:
Assignee:
Dainippon Ink and Chemicals Co., Ltd.
International Classes:
C08F2/44; C08F265/06; C08F220/10; C08F289/00; C08F290/00; C08F290/04; C08J5/24; C08L33/06; C08F290/06; (IPC1-7): C08F290/04; C08F2/44
Attorney, Agent or Firm:
Kono Tsuyo