Title:
感活性光線性又は感放射線性樹脂組成物の製造方法、パターン形成方法、及び電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP7310007
Kind Code:
B2
Abstract:
The present invention provides a method for producing an active light sensitive or radiation sensitive resin composition that is improved in terms of agglomeration defects caused by a starting material, a pattern forming method which uses this production method, and a method for producing an electronic device by means of: a method for producing an active light sensitive or radiation sensitive resin composition, said method sequentially comprising, in the following order, a step (1) wherein a resin, a compound that generates an acid upon irradiation with active light or radiation, an acid diffusion control agent and a solvent are put into a container, and a step (2) wherein at least one of the resin, the compound that generates an acid upon irradiation with active light or radiation, the acid diffusion control agent and the solvent is additionally put into the container that contains the resin, the compound that generates an acid upon irradiation with active light or radiation, the acid diffusion control agent and the solvent; a pattern forming method which uses this production method; and a method for producing an electronic device.
Inventors:
Fumihiro Yoshino
Keimitsu Tomiga
Yuma Kurumisawa
Kohei Higashi
Takumi Tanaka
Keimitsu Tomiga
Yuma Kurumisawa
Kohei Higashi
Takumi Tanaka
Application Number:
JP2022503315A
Publication Date:
July 18, 2023
Filing Date:
February 18, 2021
Export Citation:
Assignee:
Fujifilm Corporation
International Classes:
G03F7/26; C07D327/06; C07D335/02; C09K3/00; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
| JP2017129663A |
Foreign References:
| WO2019187783A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Koei Office
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