Title:
活性エネルギー線硬化型組成物
Document Type and Number:
Japanese Patent JP6927233
Kind Code:
B2
Abstract:
The present invention addresses the problem of providing: a solvent-free active energy ray-curable composition which has a low viscosity without using a solvent for the composition, while enabling a cured product thereof to have excellent hardness, scratch resistance and adhesion to a substrate; and preferably, an active energy ray-curable composition for shaping materials and for hard coatings. The present invention is an active energy ray-curable composition which contains the components (A), (B) and (C) described below, and wherein 40-95% by weight of the component (A), 5-60% by weight of the component (B) and 0-55% by weight of the component (C) are contained in 100% by weight of the total of the components (A), (B) and (C). Component (A): A (meth)acrylate mixture which is mainly composed of glycerol tri(meth)acrylate, and wherein the amount of high molecular weight substances in the component (A) as determined by gel permeation chromatography is less than 30% in terms of an area ratio defined by a specific formula Component (B): A filler Component (C): An ethylenically unsaturated compound other than the component (A)
Inventors:
Kazuki Ofusa
Kazumasa Inada
Kentaro Taniuchi
Kazumasa Inada
Kentaro Taniuchi
Application Number:
JP2018551651A
Publication Date:
August 25, 2021
Filing Date:
November 14, 2017
Export Citation:
Assignee:
Toagosei Co., Ltd.
International Classes:
C08F2/50; C07C67/03; C07C69/54; C08F2/44; C08F290/06; C09D4/02; C09D7/61
Domestic Patent References:
JP2013231167A | ||||
JP10198032A | ||||
JP4929632B1 |
Foreign References:
WO2017033732A1 | ||||
WO2017002964A1 | ||||
WO2015159611A1 |