To obtain an active energy ray curable resin composition excellent in water resistance and adhesion to a substrate while having advantages possessed by a resin composition of an ultraviolet curing system and capable of withstanding short-circuiting across electrodes by migration.
This active energy ray curable resin composition is a resin composition characterized in that the composition comprises (A) an active energy ray curable resin and (B) a photoradical polymerization initiator and ≥50 mass % of the component (A) is (A') an active energy ray curable resin having one radically polymerizable ethylenically unsaturated double bond and one or more hydroxy groups and aromatic rings in the molecule according to a first fundamental mode thereof and the composition comprises (C) an epoxy resin in addition to the above components according to a second mode, further (D) an unsaturated polyester resin in addition to the above components according to a third mode and (E) a silane coupling agent in addition to the above components according to a fourth mode.
| JP4254394 | Epoxy resin composition and semiconductor device |
| WO/2023/162975 | SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE |
| JP2001089639 | ENERGY RAY-CURING RESIN COMPOSITION |
ARIMA MASAO
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