PURPOSE: To obtain an addition-polymerizable imide resin composition which can give a molding of a low coefficient of thermal expansion and is suitable as a material for a duplicating machine or the like, by selecting an unsaturated bisimide and a diamine so that at least either of them may contain a specified structural part and mixing them as a resin component.
CONSTITUTION: The title resin composition is prepared by selecting an unsaturated bisimide of formula I (wherein D is a bivalent group having a C-C double bond, and R1 is a bivalent 2C or higher group), e.g., N,N'-ethylenebismaleimide) and a diamine of formula II (wherein R2 is a bivalent 30C or lower group), e.g., 4,4'-diaminodicyclohexylmethane, so that either of R1 in formula I and R2 in formula II may contain a structural part of formula III and mixing them as a resin component. In formula III, n is 0 or 1, m≥0, X is a benzene nucleus or a napthalene nucleus and A is a group of formula IV, -N=CH-, -CH=CH-, -N=N- or the like.
OGASAWARA KENJI
SUGAWA YOSHIHISA
| JP45022553A | ||||
| JPS463845A | ||||
| JPS463846A | ||||
| JP46023250A | ||||
| JPS57164125A | 1982-10-08 | |||
| JPS5856375A | 1983-04-04 | |||
| JPS5945322A | 1984-03-14 |
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