Title:
ADDITION REACTION-CURABLE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018154685
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an addition reaction-curable resin composition which has high gas barrier properties and storage stability and is thus free from deterioration in gas barrier properties even after long-term storage, and to provide an optical semiconductor device in which an optical semiconductor element is sealed with a cured product of the addition reaction-curable resin composition.SOLUTION: The addition reaction-curable resin composition contains: an organopolysiloxane (A) having at least two silicon-bonded alkenyl groups reactive with SiH groups in one molecule; an organohydrogenpolysiloxane (B) having at least two SiH groups in one molecule; an organic cyclic compound (C) having two or more alkenyl groups and having an epoxy group; an organic cyclic compound (D) represented by formula (I); and a curing catalyst (E) necessary for an addition reaction.SELECTED DRAWING: None
Inventors:
MASHITA TAKUSHI
Application Number:
JP2017051079A
Publication Date:
October 04, 2018
Filing Date:
March 16, 2017
Export Citation:
Assignee:
AICA KOGYO CO LTD
International Classes:
C08L83/04; C08K5/1515; C08K5/544; C08L83/05; H01L23/29; H01L23/31; H01L33/56