To provide an additive capable of ensuring the PED stability of a photoresist composition.
A urea compound of formula 1 having an appropriate level of basicity is introduced as an additive into a photoresist composition. The effect of amines present in the external air is reduced by the additive and the formation of no pattern or a T-top due to post-exposure retardation is effectively prevented in a lithography step utilizing a light source such as KrF, ArF or EUV. In the formula 1, A is formula 2 or R7; R is a 1-20C straight chain or side chain alkylene, an arylene, an alkylene containing an ether bond or an arylene containing an ether bond; R1-R7 are each H, a 1-20C straight chain or side chain alkyl or an aryl, and R1 and R2, R5 and R6, and R3 and R7 may have a structure combined with a cyclic structure.
KO KONKEI
LEE GEUN SU
BAIK KI HO
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