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Title:
ADDITIVE, METHOD FOR PREPARING COMPOUND, PHOTORESIST COMPOSITION, PHOTORESIST PATTERN FORMING METHOD AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2001142216
Kind Code:
A
Abstract:

To provide an additive capable of ensuring the PED stability of a photoresist composition.

A urea compound of formula 1 having an appropriate level of basicity is introduced as an additive into a photoresist composition. The effect of amines present in the external air is reduced by the additive and the formation of no pattern or a T-top due to post-exposure retardation is effectively prevented in a lithography step utilizing a light source such as KrF, ArF or EUV. In the formula 1, A is formula 2 or R7; R is a 1-20C straight chain or side chain alkylene, an arylene, an alkylene containing an ether bond or an arylene containing an ether bond; R1-R7 are each H, a 1-20C straight chain or side chain alkyl or an aryl, and R1 and R2, R5 and R6, and R3 and R7 may have a structure combined with a cyclic structure.


Inventors:
JUNG JAE CHANG
KO KONKEI
LEE GEUN SU
BAIK KI HO
Application Number:
JP2000261342A
Publication Date:
May 25, 2001
Filing Date:
August 30, 2000
Export Citation:
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Assignee:
HYUNDAI ELECTRONICS IND
International Classes:
C07C273/18; C07C275/06; C07C275/28; C07D487/08; C08K5/00; C08K5/21; C08L45/00; G03F7/004; G03F7/038; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; C07C273/18; C07C275/06; C08K5/00; C08L45/00; G03F7/004; H01L21/027
Domestic Patent References:
JPS62179580A1987-08-06
JPH03181543A1991-08-07
JPS63179998A1988-07-23
JPS5865438A1983-04-19
JP2002040644A2002-02-06
JPH10177247A1998-06-30
Attorney, Agent or Firm:
Hiroshi Arafune (1 person outside)