To provide an additive for a resin which can impart excellent thermal shock resistance even in a resin after moisture absorption, a curable resin composition which can form a cured resin having the excellent thermal shock resistance even after the moisture absorption, and the cured resin having the excellent thermal shock resistance even after the moisture absorption.
An additive for a resin comprises a powder of silicone rubber with an average particle diameter of 0.1-100 μm, the rubber having a moisture absorption rate of not more than 0.20 wt.% after a 20 hr treatment under conditions of 121°C, 2 atm, and 100% relative humidity. A curable resin composition contains the additive for the resin. A cured resin is obtained by curing the curable resin composition.
KOBAYASHI KAZUO
UEKI HIROSHI
FURUKAWA HARUHIKO
